Please use this identifier to cite or link to this item: http://bura.brunel.ac.uk/handle/2438/1385
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dc.contributor.authorJones, BJ-
dc.contributor.authorKenyon, AJ-
dc.date.accessioned2007-12-06T11:15:26Z-
dc.date.available2007-12-06T11:15:26Z-
dc.date.issued2007-
dc.identifier.citationForensic Sci. Int. 177: 42, Dec 2007en
dc.identifier.urihttp://bura.brunel.ac.uk/handle/2438/1385-
dc.description.abstractExamination of various SIM cards and smart card devices indicates that data may be retained in SIM card memory structures even after heating to temperatures up to 450oC, which the National Institute of Standards and Technology (NIST) has determined to be approximately the maximum average sustained temperature at desk height in a house fire. However, in many cases, and certainly for temperatures greater than 450oC, the SIM card chip has suffered structural or mechanical damage that renders simple probing or rewiring ineffective. Nevertheless, this has not necessarily affected the data, which is stored as charge in floating gates, and alternative methods for directly accessing the stored charge may be applicable.en
dc.format.extent178205 bytes-
dc.format.mimetypeapplication/pdf-
dc.language.isoen-
dc.publisherElsevier BVen
dc.relation.ispartofExperimental Techniques Centre (ETC);-
dc.subjectSIM carden
dc.subjectMobile phoneen
dc.subjectFireen
dc.subjectData recoveryen
dc.subjectScanning probe microscopyen
dc.titleRetention of data in heat-damaged SIM cards and potential recovery methodsen
dc.typeResearch Paperen
dc.identifier.doihttp://dx.doi.org/10.1016/j.forsciint.2007.10.007-
Appears in Collections:Materials Engineering
The Experimental Techniques Centre

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