RF circulator structures via offset lithography

Please use this identifier to cite or link to this item: http://bura.brunel.ac.uk/handle/2438/1939

Full metadata record

DC Field	Value	Language
dc.contributor.author	Evans, PSA	-
dc.contributor.author	Harrey, PM	-
dc.contributor.author	Ramsey, BJ	-
dc.contributor.author	Harrison, DJ	-
dc.coverage.spatial	3	en
dc.date.accessioned	2008-04-04T10:56:20Z	-
dc.date.available	2008-04-04T10:56:20Z	-
dc.date.issued	1999	-
dc.identifier.citation	I.E.E. Electronics Letters, 35(19): 1634	en
dc.identifier.issn	0013-5194	-
dc.identifier.uri	http://bura.brunel.ac.uk/handle/2438/1939	-
dc.description.abstract	Further developments are reported of the conductive lithographic film (CLF) process in which components of radio-frequency circulators are fabricated economically via offset lithography. The performance of centre conductor elements printed from silver-loaded inks on polymer substrates is compared with that of conventional solid copper structures.	en
dc.format.extent	420535 bytes	-
dc.format.mimetype	application/pdf	-
dc.language.iso	en	-
dc.publisher	IEEE	en
dc.subject	Conductors (electric)	en
dc.subject	Lithography	-
dc.subject	Microwave circulators	-
dc.title	RF circulator structures via offset lithography	en
dc.type	Research Paper	en
dc.identifier.doi	http://dx.doi.org/10.1049/el:19991131	-
Appears in Collections:	Design Brunel Design School Research Papers

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