Browsing by Subject electronics cooling

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Showing results 1 to 7 of 7
Issue DateTitleAuthor(s)
23-Oct-2020Effect of Aspect Ratio on Flow Boiling Characteristics in MicrochannelsAl-Zaidi, AH; Mahmoud, MM; Karayiannis, TG
13-Jun-2022Flow Boiling in copper and aluminium microchannelsAl-Zaidi, AH; Mahmoud, MM; Karayiannis, TG
8-Apr-2025Flow Boiling in Micro-Gap, Multi-Channels and Micro-Pin Fin Heat ExchangersAl-Zaidi, AH; Mahmoud, MM; Ivanov, A; Karayiannis, TG
6-Jun-2019Flow boiling of HFE-7100 in microchannels: Experimental study and comparison with correlationsAl-Zaidi, AH; Mahmoud, MM; Karayiannis, TG
14-Oct-2020Flow Boiling of HFE-7100 in Multi-Microchannels: Effect of Surface MaterialAl-Zaidi, AH; Mahmoud, MM; Karayiannis, TG
12-May-2021Numerical study of nanocomposite phase change material-based heat sink for the passive cooling of electronic componentsArshad, A; Jabbal, M; Faraji, H; Talebizadehsardari, P; Bashir, MA; Yan, Y
19-May-2021Thermal process enhancement of HNCPCM filled heat sink: Effect of hybrid nanoparticles ratio and shapeArshad, A; Jabbal, M; Faraji, H; Bashir, MA; Talebizadehsardari, P; Yan, Y