Issue Date | Title | Author(s) |
21-Oct-2022 | Degassing of Aluminum Alloy Melts by High Shear Melt Conditioning Technology: An Overview | Lazaro Nebreda, J; Patel, J; Lordan, E; Zhang, Y; Karakulak, E; Al-Helal, K; Scamans, G; Fan, Z |
28-Mar-2023 | Die-cast multicomponent near-eutectic and hypoeutectic Al–Si–Ni–Fe–Mn alloys: Microstructures and mechanical properties | Cai, Q; Lordan, E; Wang, S; Liu, G; Mendis, CL; Chang, ITH; Ji, S |
9-Oct-2018 | Effective Degassing for Reduced Variability in High-Pressure Die Casting Performance | Lordan, E; Lazaro Nebreda, J; Zhang, Y; Fan, Z |
23-Sep-2022 | High-Pressure Die Casting: A Review of Progress from the EPSRC Future LiME Hub | Lordan, E; Zhang, Y; Dou, K; Jacot, A; Tzileroglou, C; Wang, S; Wang, Y; Patel, J; Lazaro-Nebreda, J; Zhou, X; Hashimoto, T; Fan, Z |
24-Jan-2019 | Improve mechanical properties of high pressure die cast Al9Si3Cu alloy via dislocation enhanced precipitation | Zhang, Y; Wang, S; Lordan, E; Wang, Y; Fan, Z |
8-Aug-2023 | A novel Al-Si-Ni-Fe near-eutectic alloy for elevated temperature applications | Cai, Q; Fang, C; Lordan, E; Wang, Y; Chang, ITH; Cantor, B |
1-Jul-2019 | Numerical simulation of fluid flow, solidification and defects in high pressure die casting (HPDC) process | Dou, K; Lordan, E; Zhang, Y; Jacot, A; Fan, Z |
4-May-2021 | On the probabilistic nature of high-pressure die casting | Lordan, E; Zhang, Y; Dou, K; Jacot, A; Tzileroglou, C; Blake, P; Fan, Z |
14-Feb-2020 | On the relationship between internal porosity and the tensile ductility of aluminium alloy die-castings | Lordan, E; Lazaro-Nebreda, J; Zhang, Y; Dou, K; Blake, P; Fan, Z |
10-May-2021 | Turbulent breakup of non-metallic inclusions and equiaxed crystals during solidification of a hypoeutectic Al-Si alloy | Lordan, E; Zhang, Y; Dou, K; Tzileroglou, C; Jacot, A; Blake, P; Fan, Z |
2-Jun-2022 | Understanding the Initial Solidification Behavior for Al–Si Alloy in Cold Chamber High-Pressure Die Casting (CC-HPDC) Process Combining Experimental and Modeling Approach | Dou, K; Zhang, Y; Lordan, E; Jacot, A; Fan, Z |