Please use this identifier to cite or link to this item: http://bura.brunel.ac.uk/handle/2438/12709
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dc.contributor.authorAl-Hnaity, B-
dc.contributor.authorAbbod, M-
dc.contributor.authorAlar'Raj, M-
dc.date.accessioned2016-06-02T15:28:09Z-
dc.date.available2015-12-18-
dc.date.available2016-06-02T15:28:09Z-
dc.date.issued2015-
dc.identifier.citationProceedings of 2015 SAI Intelligent Systems Conference (IntelliSys), pp. 49 - 54, London, UK, (2015)en_US
dc.identifier.isbn9781467376068-
dc.identifier.urihttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7361083-
dc.identifier.urihttp://bura.brunel.ac.uk/handle/2438/12709-
dc.description.abstractPrediction financial time series (stock index price) is the most challenging task. Support vector regression (SVR), Support vector machine (SVM) and back propagation neural network (BPNN) are the most popular data mining techniques in prediction financial time series. In this paper a hybrid combination model is introduced to combine the three models and to be most beneficial of them all. Quantization factor is used in this paper for the first time to improve the single SVM and SVR prediction output. And also genetic algorithm (GA) used to determine the weights of the proposed model. FTSE100 daily index closing price is used to evaluate the proposed model performance. The proposed hybrid model numerical results shows the outperform result over all other single model and the traditional simple average combiner.en_US
dc.format.extent49 - 54-
dc.language.isoenen_US
dc.publisherIEEEen_US
dc.subjectBack propagation neural networken_US
dc.subjectFTSE 100 stock indexen_US
dc.subjectGenetic algorithmen_US
dc.subjectHybrid modelen_US
dc.subjectStylingen_US
dc.subjectSupport vector machineen_US
dc.titlePredicting FTSE 100 close price using hybrid modelen_US
dc.typeConference Paperen_US
dc.identifier.doihttp://dx.doi.org/10.1109/IntelliSys.2015.7361083-
dc.relation.isPartOfIntelliSys 2015 - Proceedings of 2015 SAI Intelligent Systems Conference-
pubs.publication-statusPublished-
Appears in Collections:Dept of Electronic and Electrical Engineering Research Papers

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