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DC Field | Value | Language |
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dc.contributor.author | Qi, M | - |
dc.contributor.author | Yin, T | - |
dc.contributor.author | Cheng, G | - |
dc.contributor.author | Xu, Y | - |
dc.contributor.author | Meng, H | - |
dc.contributor.author | Wang, Y | - |
dc.contributor.author | Cui, S | - |
dc.date.accessioned | 2022-04-01T10:04:47Z | - |
dc.date.available | 2022-04-01T10:04:47Z | - |
dc.date.issued | 2022-03-25 | - |
dc.identifier.citation | Qi, M. et al. (2022) 'Research on Printing Defects Inspection of Solder Paste Images", Wireless Communications and Mobile Computing', 2022, Article ID 8651956, pp. 1 - 9. doi: 10.1155/2022/8651956. | en_US |
dc.identifier.issn | 1530-8669 | - |
dc.identifier.uri | https://bura.brunel.ac.uk/handle/2438/24381 | - |
dc.description | Data Availability: The datasets used and/or analyzed during the current study are available from the corresponding author on reasonable request. | - |
dc.description.abstract | Copyright © 2022 Min Qi et al. Solder paste printing is the first part of the surface mount process flow; its postprinting defect inspection is particularly important. In this paper, we focus on studying the printing defects inspection algorithm for solder paste on PCB (Printed Circuit Board) images. +e work proposes a number of methods to enhance the defects inspection performance of solder paste printing: a regional multidirectional data fusion image interpolation method, which can achieve fast and high precision image interpolation; a method for detecting solder paste areas with better accuracy, efficiency, and robustness; an improved connected domain labeling method to reduce time complexity; and defects detection and types classification method, which extracts features and centroid of every solder paste region and completes the inspection by comparing with a standard image. +e experiments show that the defects inspection algorithm can detect the most common types of defects with low time consumption, high inspection accuracy, and classification accuracy. | en_US |
dc.description.sponsorship | Key Project of Shaanxi Province Innovation Program, China (2017ZDCXL-GY-11-02-02) | en_US |
dc.format.extent | 1 - 9 | - |
dc.language | English | - |
dc.language.iso | en | en_US |
dc.publisher | Hindawi Limited | en_US |
dc.rights | Copyright © 2022 Min Qi et al. This is an open access article distributed under the Creative Commons Attribution License (https://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. | - |
dc.rights.uri | https://creativecommons.org/licenses/by/4.0/ | - |
dc.rights.uri | https://creativecommons.org/licenses/by/4.0/ | - |
dc.subject | solder paste inspection | en_US |
dc.subject | image interpolation | en_US |
dc.subject | solder paste area detection | en_US |
dc.subject | connected domain labeling | en_US |
dc.title | Research on Printing Defects Inspection of Solder Paste Images | en_US |
dc.type | Article | en_US |
dc.identifier.doi | https://doi.org/10.1155/2022/8651956 | - |
dc.relation.isPartOf | Wireless Communications and Mobile Computing | - |
pubs.publication-status | Published | - |
pubs.volume | 2022 | - |
dc.identifier.eissn | 1530-8677 | - |
dc.rights.holder | Min Qi et al. | - |
Appears in Collections: | Dept of Electronic and Electrical Engineering Research Papers |
Files in This Item:
File | Description | Size | Format | |
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FullText.pdf | Copyright © 2022 Min Qi et al. This is an open access article distributed under the Creative Commons Attribution License (https://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. | 3.33 MB | Adobe PDF | View/Open |
This item is licensed under a Creative Commons License