PCBA Image Analysis: A Comparison of Visible, Infrared & X-ray Wavelengths

Abstract

In the manufacture of printed circuit boards (PCB), various tests must be performed to ensure minimal defects are present in the final product. This is often done through visual inspection, using both X-rays as well as visible light, with X-rays often being superior due to the ability to capture internal features and defects. However, health and safety risks with X-rays lead to other, safer alternatives being desirable if they can provide comparable results. This work evaluates the visible differences between a range of near infrared (NIR) wavelengths using NIR hyperspectral imaging, as well as comparison to both X-ray and visible light images, to identify unique features that would benefit defect detection at each wavelength. Additionally, a small sample of NIR, visible light and X-ray PCBA images will be made public.