Please use this identifier to cite or link to this item: http://bura.brunel.ac.uk/handle/2438/30870
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dc.contributor.authorGao, H-
dc.contributor.authorJin, Y-
dc.contributor.authorLi, M-
dc.contributor.authorChen, Y-
dc.contributor.authorZang, J-
dc.contributor.authorFan, X-
dc.date.accessioned2025-03-03T14:40:04Z-
dc.date.available2024-12-31-
dc.date.available2025-03-03T14:40:04Z-
dc.date.issued2024-12-31-
dc.identifierORCiD: Maozhen Li https://orcid.org/0000-0002-0820-5487-
dc.identifier.citationGao, H. et al. (2024) 'Bonding Defect Detection Based on Improved Single Shot MultiBox Detector', Computing and Informatics, 43 (6), pp. 1432 - 1454. doi: 10.31577/cai_2024_6_1432.en_US
dc.identifier.issn1335-9150-
dc.identifier.urihttps://bura.brunel.ac.uk/handle/2438/30870-
dc.description.abstractTo solve the problem of time-consuming and low efficiency in manual defect detection, this paper proposes a bonding defect detection algorithm based on improved Single Shot MultiBox Detector (SSD). DenseNet is used to replace VGG of the SSD algorithm to improve the detection effect of bonding defect. A novel feature fusion network is designed, in which dilated convolution is used to reduce the size of the low-level feature map, and it is fused with the high-level feature map, and then the Convolutional Block Attention Module (CBAM) attention mechanism is used to increase the ability to extract the features. Focal loss is used to control the ratio of positive and negative samples for training and suppress easily separable samples, so that the samples involved in training have better distribution and the model has better detection performance. Then, the defect data set is constructed and a comparison experiment is carried out. The results show that the mAP, Precision, and Recall of the improved SSD network are increased to 75.9 %, 77.3 %, and 75.6 %, respectively, which can better identify bonding defect.en_US
dc.description.sponsorshipThis work was supported by the Research Project supported by the Shanxi Scholarship Council of China under Grant No. 2022-145.en_US
dc.format.extent1432 - 1454-
dc.format.mediumPrint-Electronic-
dc.languageEnglish-
dc.language.isoen_USen_US
dc.publisherBratislava Institute of Informatics, Slovak Academy of Sciencesen_US
dc.rightsAttribution-NonCommercial-NoDerivatives 4.0 International-
dc.rights.urihttps://creativecommons.org/licenses/by-nc-nd/4.0/-
dc.subjectSSDen_US
dc.subjectdefect detectionen_US
dc.subjectDenseNeten_US
dc.subjectdilated convolutionen_US
dc.subjectCBAMen_US
dc.subjectfocal lossen_US
dc.titleBonding Defect Detection Based on Improved Single Shot MultiBox Detectoren_US
dc.typeArticleen_US
dc.identifier.doihttps://doi.org/10.31577/cai_2024_6_1432-
dc.relation.isPartOfComputing and Informatics-
pubs.issue6-
pubs.publication-statusPublished-
pubs.volume43-
dc.identifier.eissn2585-8807-
dc.rights.licensehttps://creativecommons.org/licenses/by-nc-nd/4.0/legalcode.en-
dc.rights.holderSlovak Academy of Sciences-
Appears in Collections:Dept of Electronic and Electrical Engineering Research Papers

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