Please use this identifier to cite or link to this item: http://bura.brunel.ac.uk/handle/2438/31235
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dc.contributor.authorLuo, Y-
dc.contributor.authorBall, P-
dc.contributor.authorQi, K-
dc.contributor.authorZhao, X-
dc.coverage.spatialCoventry, UK-
dc.date.accessioned2025-05-14T12:22:12Z-
dc.date.available2025-05-14T12:22:12Z-
dc.date.issued2025-04-09-
dc.identifierORCiD: Kun Qi https://orcid.org/0000-0003-2348-5007-
dc.identifier.citationLuo, Y. et al. (2025) 'Digital twin-optimised repurposing of spent mushroom substrate into circular bio-based composites', Proceedings of the International Conference on Manufacturing of Advanced Composites 2025 (ICMAC 2025), Coventry, UK, 9-10 April, pp. 1 - 2.en_US
dc.identifier.urihttps://bura.brunel.ac.uk/handle/2438/31235-
dc.description.abstractThe global mushroom industry generates over 60 million tons of spent mushroom substrate (SMS) annually, presenting both an environmental challenge and an opportunity for sustainable material development (Grimm et al., 2018) ...en_US
dc.language.isoenen_US
dc.publisherInstitute of Materials, Minerals and Mining (IOM3)en_US
dc.sourceInternational Conference on Manufacturing of Advanced Composites 2025 (ICMAC 2025)-
dc.sourceInternational Conference on Manufacturing of Advanced Composites 2025 (ICMAC 2025)-
dc.sourceInternational Conference on Manufacturing of Advanced Composites 2025 (ICMAC 2025)-
dc.subjectdigital twinen_US
dc.subjecttwin-screw extrusionen_US
dc.subjectspent mushroom substrateen_US
dc.subjectbio-based insulationen_US
dc.subjectcircular economyen_US
dc.subjectsustainable manufacturingen_US
dc.titleDigital twin-optimised repurposing of spent mushroom substrate into circular bio-based compositesen_US
dc.typeConference Paperen_US
dc.date.dateAccepted2025-03-05-
pubs.finish-date2025-04-10-
pubs.finish-date2025-04-10-
pubs.finish-date2025-04-10-
pubs.publication-statusAccepted-
pubs.start-date2025-04-09-
pubs.start-date2025-04-09-
pubs.start-date2025-04-09-
dcterms.dateAccepted2025-03-05-
Appears in Collections:Dept of Chemical Engineering Research Papers

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