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dc.contributor.authorKotadia, HR-
dc.contributor.authorQian, M-
dc.contributor.authorEskin, DG-
dc.contributor.authorDas, A-
dc.identifier.citationMaterials & Design, 2017en_US
dc.description.abstractPhysical grain refinement is examined under high-intensity ultrasonication during solidification in commercial purity Al (CP-Al) and binary Al-10wt.% Cu alloy melts cooled naturally in air and compared against chemical inoculation using Al-5Ti-1B grain refiner. The coarse dendritic unrefined base microstructure was completely replaced with a fine equiaxed grain structure in the case of either inoculation or ultrasonication. However, ultrasonication produced more effective refinement over chemical inoculation with a two-fold and eight-fold increase in the grain density in CP-Al and Al-10%Cu alloy, respectively. While combining chemical inoculation with ultrasonication produced the finest grain structure in CP-Al, no further improvement over ultrasonication was noted for the Al-10%Cu alloy. Noticeable reduction in nucleation undercooling, of similar magnitude to chemical inoculation, was observed under ultrasonication. Cooling curve observations indicate strongly enhanced heterogeneous nucleation under ultrasonication. It appears that although nucleation potency could be higher under chemical inoculation, more nucleation events are favoured under cavitation.en_US
dc.subjectGrain refiningen_US
dc.subjectAl-Ti-B refineren_US
dc.subjectAluminium alloysen_US
dc.subjectSolidification microstructureen_US
dc.titleOn the microstructural refinement in commercial purity Al and Al-10 wt% Cu alloy under ultrasonication during solidificationen_US
dc.relation.isPartOfMaterials & Design-
Appears in Collections:Dept of Mechanical Aerospace and Civil Engineering Embargoed Research Papers

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