Please use this identifier to cite or link to this item:
http://bura.brunel.ac.uk/handle/2438/1939
Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Evans, PSA | - |
dc.contributor.author | Harrey, PM | - |
dc.contributor.author | Ramsey, BJ | - |
dc.contributor.author | Harrison, DJ | - |
dc.coverage.spatial | 3 | en |
dc.date.accessioned | 2008-04-04T10:56:20Z | - |
dc.date.available | 2008-04-04T10:56:20Z | - |
dc.date.issued | 1999 | - |
dc.identifier.citation | I.E.E. Electronics Letters, 35(19): 1634 | en |
dc.identifier.issn | 0013-5194 | - |
dc.identifier.uri | http://bura.brunel.ac.uk/handle/2438/1939 | - |
dc.description.abstract | Further developments are reported of the conductive lithographic film (CLF) process in which components of radio-frequency circulators are fabricated economically via offset lithography. The performance of centre conductor elements printed from silver-loaded inks on polymer substrates is compared with that of conventional solid copper structures. | en |
dc.format.extent | 420535 bytes | - |
dc.format.mimetype | application/pdf | - |
dc.language.iso | en | - |
dc.publisher | IEEE | en |
dc.subject | Conductors (electric) | en |
dc.subject | Lithography | - |
dc.subject | Microwave circulators | - |
dc.title | RF circulator structures via offset lithography | en |
dc.type | Research Paper | en |
dc.identifier.doi | http://dx.doi.org/10.1049/el:19991131 | - |
Appears in Collections: | Design Brunel Design School Research Papers |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
RF circulator structures via offset lithography.pdf | 410.68 kB | Adobe PDF | View/Open |
Items in BURA are protected by copyright, with all rights reserved, unless otherwise indicated.