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Please use this identifier to cite or link to this item: http://bura.brunel.ac.uk/handle/2438/25164
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dc.contributor.authorArshad, A-
dc.contributor.authorJabbal, M-
dc.contributor.authorFaraji, H-
dc.contributor.authorTalebizadehsardari, P-
dc.contributor.authorBashir, MA-
dc.contributor.authorYan, Y-
dc.date.accessioned2022-09-07T10:21:49Z-
dc.date.available2022-09-07T10:21:49Z-
dc.date.issued2021-05-12-
dc.identifier.citationArshad, A. et al. (2021) 'Numerical study of nanocomposite phase change material-based heat sink for the passive cooling of electronic components', Heat and Mass Transfer, 0 (in press), pp. 1 - 15 (15). doi: 10.1007/s00231-021-03065-2.en_US
dc.identifier.issn0947-7411-
dc.identifier.urihttps://bura.brunel.ac.uk/handle/2438/25164-
dc.description.sponsorshipUniversity of Nottingham Faculty of Engineering Research Excellence PhD Scholarshipen_US
dc.format.extent1 - 15 (15)-
dc.format.mediumPrint-Electronic-
dc.languageEnglish-
dc.language.isoen_USen_US
dc.publisherSpringer Natureen_US
dc.rightsThis is a pre-copyedited, author-produced version of an article accepted for publication Heat and Mass Transfer, following peer review. The final authenticated version is available online at https://doi.org/10.1007/s00231-021-03065-2.-
dc.rights.urihttps://www.springernature.com/gp/open-research/policies/journal-policies-
dc.subjectnanocomposite phase change materialen_US
dc.subjectcopper nanoparticlesen_US
dc.subjectheat sinken_US
dc.subjectelectronics coolingen_US
dc.titleNumerical study of nanocomposite phase change material-based heat sink for the passive cooling of electronic componentsen_US
dc.typeArticleen_US
dc.identifier.doihttps://doi.org/10.1007/s00231-021-03065-2-
dc.relation.isPartOfHeat and Mass Transfer/Waerme- und Stoffuebertragung-
pubs.issuein press-
pubs.publication-statusPublished-
pubs.volume0-
dc.identifier.eissn1432-1181-
dc.rights.holderSpringer Nature-
Appears in Collections:Dept of Mechanical and Aerospace Engineering Research Papers

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