Please use this identifier to cite or link to this item:
|Title:||Microstructural evolution in materials during thermal processing|
|Publisher:||Hindawi Publishing Corporation|
|Citation:||Advances in Materials Science and Engineering, 2012: 302478, 2012|
|Description:||Copyright © 2012 Joseph K. L. Lai et al. This is an open access article distributed under the Creative Commons Attribution
License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.|
This article has been made available through the Brunel Open Access Publishing Fund.
|Appears in Collections:||Materials Engineering|
Brunel OA Publishing Fund
Dept of Mechanical Aerospace and Civil Engineering Research Papers
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