Please use this identifier to cite or link to this item:
Title: Detecting defects in PCB using deep learning via convolution neural networks
Authors: Adibhatla, VA
Shieh, JS
Abbod, MF
Chih, HC
Hsu, CC
Cheng, J
Keywords: Convolution;Deep learning;Training;Inspection
Issue Date: 2019
Publisher: IEEE
Citation: Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2019, 2018-October pp. 202 - 205
ISSN: 2150-5934
Appears in Collections:Dept of Electronic and Computer Engineering Embargoed Research Papers

Files in This Item:
File Description SizeFormat 
FullText.pdfEmbargoed until 1/1/2030650.32 kBAdobe PDFView/Open

Items in BURA are protected by copyright, with all rights reserved, unless otherwise indicated.