Please use this identifier to cite or link to this item:
http://bura.brunel.ac.uk/handle/2438/17785
Title: | Microstructure, dynamic restoration and recrystallization texture of Sn-Cu after rolling at room temperature |
Authors: | Liu, G Ji, S |
Keywords: | Sn-Cu alloy;rolling;dislocation;recrystallization;twin;texture |
Issue Date: | 19-Feb-2019 |
Publisher: | Elsevier |
Citation: | Liu, G. and Ji, S. (2019) 'Microstructure, dynamic restoration and recrystallization texture of Sn-Cu after rolling at room temperature', Materials Characterization, 150, pp. 174 - 183. doi: 10.1016/j.matchar.2019.02.032. |
Description: | Data availability: The raw/processed data required to reproduce these findings cannot be shared at this time as the data also forms part of an ongoing study. |
URI: | https://bura.brunel.ac.uk/handle/2438/17785 |
DOI: | https://doi.org/10.1016/j.matchar.2019.02.032 |
ISSN: | 1044-5803 |
Appears in Collections: | Brunel Centre for Advanced Solidification Technology (BCAST) |
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