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http://bura.brunel.ac.uk/handle/2438/17785| Title: | Microstructure, dynamic restoration and recrystallization texture of Sn-Cu after rolling at room temperature |
| Authors: | Liu, G Ji, S |
| Keywords: | Sn-Cu alloy;rolling;dislocation;recrystallization;twin;texture |
| Issue Date: | 19-Feb-2019 |
| Publisher: | Elsevier |
| Citation: | Liu, G. and Ji, S. (2019) 'Microstructure, dynamic restoration and recrystallization texture of Sn-Cu after rolling at room temperature', Materials Characterization, 150, pp. 174 - 183. doi: 10.1016/j.matchar.2019.02.032. |
| Description: | Data availability: The raw/processed data required to reproduce these findings cannot be shared at this time as the data also forms part of an ongoing study. |
| URI: | https://bura.brunel.ac.uk/handle/2438/17785 |
| DOI: | https://doi.org/10.1016/j.matchar.2019.02.032 |
| ISSN: | 1044-5803 |
| Appears in Collections: | Brunel Centre for Advanced Solidification Technology (BCAST) |
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| File | Description | Size | Format | |
|---|---|---|---|---|
| FullText.pdf | Copyright © 2019 Elsevier Ltd. All rights reserved. This is the accepted manuscript version of an article which has been published in final form at https://doi.org/10.1016/j.matchar.2019.02.032, archived on this repository under a Creative Commons CC BY-NC-ND attribution licence. | 1.06 MB | Adobe PDF | View/Open |
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