Please use this identifier to cite or link to this item:
http://bura.brunel.ac.uk/handle/2438/28545
Title: | Wideband Back-Cover Antenna Design Using Dual Characteristic Modes With High Isolation for 5G MIMO Smartphone |
Authors: | Hu, W Chen, Z Qian, L Wen, L Luo, Q Xu, R Jiang, W Gao, S |
Keywords: | back-cover antenna;characteristic mode (CM);dual-antenna pair;fifth generation (5G);MIMO smartphone antenna |
Issue Date: | 28-Jan-2022 |
Publisher: | Institute of Electrical and Electronics Engineers (IEEE) |
Citation: | Hu, W. et al. (2022) 'Wideband Back-Cover Antenna Design Using Dual Characteristic Modes With High Isolation for 5G MIMO Smartphone', IEEE Transactions on Antennas and Propagation, 70 (7), pp. 5254 - 5265. doi: 10.1109/TAP.2022.3145456. |
Abstract: | A novel method of designing a wideband high-isolated dual-antenna pair using dual-characteristic modes (CMs) is presented for fifth-generation (5G) multiple-input multiple-output (MIMO) smartphone applications. A set of orthogonal CMs resonating from the square-loop slot is first introduced and works for the lower band. Then, another set of orthogonal CMs resonating from the edge branches is introduced with a shared compact radiator and works for the higher band. In combination with two sets of degenerated CMs and a capacitive coupling feeding structure, the proposed dual-antenna pair achieves a broad impedance bandwidth and high isolation without the need for any external decoupling structures. Based on this dual-antenna pair, an 8× 8 MIMO array is developed and integrated into the back cover of a smartphone, which realizes zero ground clearance on the system circuit board. To verify the design concept, prototypes of the antenna pair and MIMO array were fabricated and measured. It shows that experimental results agree well with the simulation results. More importantly, the presented 8× 8 MIMO array has high isolation of more than 20 dB is achieved across the operating band of 3.3–3.8 GHz. |
URI: | https://bura.brunel.ac.uk/handle/2438/28545 |
DOI: | https://doi.org/10.1109/TAP.2022.3145456 |
ISSN: | 0018-926X |
Other Identifiers: | ORCiD: Wei Hu https://orcid.org/0000-0002-7077-1500 ORCiD: Zhan Chen https://orcid.org/0000-0002-9215-1011 ORCiD: Long Qian https://orcid.org/0000-0002-4518-4232 ORCiD: Lehu Wen https://orcid.org/0000-0001-9757-1114 ORCiD: Qi Luo https://orcid.org/0000-0001-9000-4133 ORCiD: Rui Xu https://orcid.org/0000-0002-1361-5456 ORCiD: Wen Jiang https://orcid.org/0000-0002-9800-2877 ORCiD: Steven Gao https://orcid.org/0000-0002-7402-9223 |
Appears in Collections: | Dept of Electronic and Electrical Engineering Embargoed Research Papers |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
FullText.pdf | Copyright © 2022 Institute of Electrical and Electronics Engineers (IEEE). Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works by sending a request to pubs-permissions@ieee.org. See https://journals.ieeeauthorcenter.ieee.org/become-an-ieee-journal-author/publishing- ethics/guidelines-and-policies/post-publication-policies/ for more information | 2.54 MB | Adobe PDF | View/Open |
Items in BURA are protected by copyright, with all rights reserved, unless otherwise indicated.