Please use this identifier to cite or link to this item: http://bura.brunel.ac.uk/handle/2438/29252
Title: PCBA Image Analysis: A Comparison of Visible, Infrared & X-ray Wavelengths
Authors: Malin, B
Kalganova, T
Danskins, J
Gilchrist, JR
Keywords: defect detection;infrared;X-ray;PCBA;hyperspectral imaging;image fusion
Issue Date: 25-Oct-2022
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Citation: Malin, B. et al. (2022) 'PCBA Image Analysis: A Comparison of Visible, Infrared & X-ray Wavelengths', 2022 IEEE Physical Assurance and Inspection of Electronics, PAINE 2022, Huntsville, AL, USA, 25-27 October, pp. 1 - 7. doi: 10.1109/PAINE56030.20.22.10014963
Abstract: In the manufacture of printed circuit boards (PCB), various tests must be performed to ensure minimal defects are present in the final product. This is often done through visual inspection, using both X-rays as well as visible light, with X-rays often being superior due to the ability to capture internal features and defects. However, health and safety risks with X-rays lead to other, safer alternatives being desirable if they can provide comparable results. This work evaluates the visible differences between a range of near infrared (NIR) wavelengths using NIR hyperspectral imaging, as well as comparison to both X-ray and visible light images, to identify unique features that would benefit defect detection at each wavelength. Additionally, a small sample of NIR, visible light and X-ray PCBA images will be made public.
URI: https://bura.brunel.ac.uk/handle/2438/29252
DOI: https://doi.org/10.1109/PAINE56030.2022.10014963
ISBN: 979-8-3503-9909-7 (ebk)
ISSN: 979-8-3503-9910-3 (PoD)
Other Identifiers: ORCiD: Tatiana Kalganova https://orcid.org/0000-0003-4859-7152
Appears in Collections:Dept of Electronic and Electrical Engineering Research Papers

Files in This Item:
File Description SizeFormat 
FullText.pdfCopyright © 2022 Institute of Electrical and Electronics Engineers (IEEE). Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works by sending a request to pubs-permissions@ieee.org. For more information, see https://journals.ieeeauthorcenter.ieee.org/becomean-ieee-journal-author/publishing-ethics/guidelines-and-policies/post-publication-policies/4.99 MBAdobe PDFView/Open


Items in BURA are protected by copyright, with all rights reserved, unless otherwise indicated.