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http://bura.brunel.ac.uk/handle/2438/31877| Title: | Application and Performance Optimization of MapReduce Model in Image Segmentation |
| Authors: | Li, M Meng, L Wang, J Jin, Y Hu, B Chen, Y |
| Keywords: | defects detection;data locality;image segmentation;MapReduce model;pipeline scheduling |
| Issue Date: | 31-Dec-2019 |
| Publisher: | Institute of Electrical and Electronics Engineers (IEEE) |
| Citation: | Li, M. et al. (2020) 'Application and Performance Optimization of MapReduce Model in Image Segmentation', IEEE Access, 8, pp. 31835 - 31844. doi: 10.1109/ACCESS.2019.2963343. |
| Abstract: | With the increase of glass detection speed, some defects of MapReduce distributed computing framework are exposed, and the processing speed and timeliness cannot meet the requirements of glass-defect detection in industrial technology. Based on the MapReduce distributed computing framework, this paper designs a threshold segmentation method to complete the segmentation of glass-defect images. By improving the replication placement strategy and pipeline scheduling mechanism, the computing and storage are localized, and the timeliness of data processing is accelerated. The experimental results show that the improved MapReduce computing framework has an average increase of 14.8% in processing speed. It can detect the glass ribbon running at 800m/h and also detect the number, position and type of defects on the glass ribbon. |
| URI: | https://bura.brunel.ac.uk/handle/2438/31877 |
| DOI: | https://doi.org/10.1109/ACCESS.2019.2963343 |
| Other Identifiers: | ORCiD: Maozhen Li https://orcid.org/0000-0002-0820-5487 ORCiD: Lu Meng https://orcid.org/0000-0002-5990-4106 ORCiD: Jiaying Wang https://orcid.org/0000-0003-3992-0771 ORCiD: Yong Jin https://orcid.org/0000-0002-7664-1416 ORCiD: Binyu Hu https://orcid.org/0000-0003-4668-9459 ORCiD: Youxing Chen https://orcid.org/0000-0002-8915-2689 |
| Appears in Collections: | Dept of Electronic and Electrical Engineering Research Papers |
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|---|---|---|---|---|
| FullText.pdf | Copyright © 2019 The Author(s) Published under license by Institute of Electrical and Electronics Engineers (IEEE). This work is licensed under a Creative Commons Attribution 4.0 License. For more information, see https://creativecommons.org/licenses/by/4.0/ | 7.35 MB | Adobe PDF | View/Open |
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